Principal Packaging Architect

Company: Arm Limited
Location: Chandler
Posted on: February 1, 2025

Job Description:

Arm has a great opportunity for a Principal Packaging Architect in our System Integration team. You will work closely with IP, SoC Design, Package Design, Signal Integrity, Power Integrity, Thermal, Thermomechanical Test and Systems teams throughout the company, to guide development of innovative packaging solutions within Arm.You will play a key role in identifying key packaging technologies, establishing 3rd party relationships, communicating with partners and addressing challenges in areas such as 2.5D/3DIC and sub-3nm nodes. The role requires passionate engineering focus in areas such as package design, assembly yield analysis, die-to-die interfaces and manufacturing technologies.Responsibilities:

• Pathfinding activities with new programs that optimize the system-level solution space
• Identifying innovative technologies that maximize the performance of Arm architectures
• Working closely with internal and external customer partners on silicon-disaggregation and other chiplet strategies for advanced packages, including emerging-memory chiplet integration
• Identifying critical elements for Arm's packaging roadmap and disseminate these use strategies to key partners
• Driving design strategies for performance and manufacturability in packaging
• Working closely with external partners for driving successful assembly prototypesRequired Skills and Experience:
  • A strong understanding of package failure mechanisms and causes
  • Expertise in package standards, 2.xD, 3D and other chiplet packaging methodologies
  • Knowledge of signal integrity, power integrity thermal and thermos-mechanical principles
  • Depth of knowledge in memory interfaces such as HBM3, GDDRR6, etc.
  • Minimum 12 years of experience in package engineering, including advanced multichip system-in-package work."Nice To Have" Skills and Experience:
    • Excellent interpersonal skills, strong initiative and open in engaging and learning new concepts and sharing with collaborators.
    • Bachelors, Masters, or Ph.D. degree or equivalent experience in Electrical Engineering or Mechanical Engineering
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Keywords: Arm Limited, Gilbert , Principal Packaging Architect, Professions , Chandler, Arizona